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The Notepad upgrade, cheaper YouTube TV, and Nova Launcher's new owner: News roundup

The tech news you may have missed this week.
IEEE

Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications

Abstract: In this study, we present a low interconnection loss antenna-in-package (AiP) using a chip-embedded metal fan-out wafer-level package (mFOWLP) technology for D-band (110–170 GHz) ...
IEEE

Impact of Strain on Sub-3 nm Gate-All-Around CMOS Logic Circuit Performance Using a Neural Compact Modeling Approach

Abstract: Impact of strain of sub-3 nm gate-all-around (GAA) CMOS transistors on the circuit performance is evaluated using a neural compact model. The model was trained using 3D technology ...