The study of lifetime distribution and reliability testing seeks to characterise the statistical behaviour of time-to-failure data for components and systems across a range of applications, from ...

As technology shrinks, Yield and Reliability (YAR) are major challenges of SoC (System on Chip) production. There are many techniques available for increasing YAR. YAR of devices depend on testing ...

Undaunted by the skyrocketing costs of new semiconductor fabs and the formidable hurdles facing the industry with each new technology node, leading IC manufacturers are continuing to strive for ...

Environmentally friendly is a term rapidly invading the electronics industry. The electronic industry will be facing great challenges over the next few years as the solder used in electronic products ...

Collaboration enables SoC manufacturers to improve their qualification envelope to achieve lifetime reliability, shorten their root cause analysis time, and reduce operational costs HAIFA, ...

Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...